Structure is a leader in computer vision and spatial computing. Our most notable products include our Structure Sensor line of 3D scanners, our Structure SDK 3D scanning software platform, and our mobile 3D capture applications for iOS. Structure is the worldwide leader in 3D reconstruction for medical applications, measured by volume of scans per year, and we plan to grow that position by continuing to deliver superior solutions to our customers.

We love it when our products deliver a seamless scanning experience, and so do our customers. We are looking for Electrical Engineer candidates who are capable of building the hardware foundation of 3D sensing for medical applications, and who are also interested in driving Structure's hardware and sensor development roadmap for the long run.

Responsibilities:

Perform PCB design for Structure's next generation of sensors, including Hardware design, schematics and PCB layout
Customize sensor designs to specific customer requirements
Assist in product development and NPI (New Product Introduction), from prototyping to mass production
Modify and troubleshoot manufacturing stations, and assist in their deployment in mass production
Provide technical leadership in the development of Structure’s Hardware Roadmap

We are looking for someone with:

B.S. in Electrical Engineering or Computer Engineering and 5+ years of experience, or equivalent
Demonstrated competency in OrCAD, Altium, EAGLE, or similar PCB design tools
Experience with embedded systems design and programming
Experience with electrical system debugging using multimeters, oscilloscopes, and logic analyzers
Strong EE, CS theory and mathematical skills

Bonus points if you have experience in the following areas:

M.S. in Electrical Engineering or Computer Engineering
Apple MFi (Made for iPad/iPhone)
USB 3.0 devices & camera interfaces
Design and integration of digital systems, including cameras & optical components
Analog design of power management systems, including batteries and chargers
Medical equipment development experience
Experience in the mass-production of consumer electronics and overseas factories
Cross-disciplinary competency in another engineering field, such as optics or mechanical engineering
Leadership and project management experience driving multiple tasks simultaneously

Work Culture:

We expect

Great teamwork and interpersonal skills, strong written and verbal communication skills, proactive attitude, and a drive for results
Demonstrated creative problem-solving approach and strong analytical, debugging, and troubleshooting skills
Proven ability to work well with others in a fast paced, iterative development environment
Attention to detail

Location:

This position is located at Structure’s R&D center in Boulder, Colorado, USA. Expect a hybrid work environment, with the opportunity to work remotely, and also at company facilities, as dictated by the work requirements.

Compensation:

Base salary ranging from $125,000 to $175,000, depending on experience and skill. Compensation also includes equity in Structure, commensurate with experience and market rates.

Other benefits:

Health care, dental, vision, 401k, parental leave, employee assistance program, life insurance, flexible working hours.

Structure is an equal opportunity employer and does not discriminate based on race, color, religion (creed), gender, gender expression, age, national origin (ancestry), disability, marital status, sexual orientation, or military status. We are committed to providing an inclusive and welcoming environment to our employees and welcome input from candidates and employees on how we can enhance our inclusiveness.